Introducing the Next-Gen Build Processor: A Joint Webinar with Nikon SLM Solutions and Materialise

See how the Next-Gen Build Processor delivers a fully validated workflow, from design to job file preparation, with faster processing and support for more complex LPBF metal builds.

When: September 22, 2026

Choose the session that fits your time zone.

• EMEA session: 2:00 PM CEST
• Americas session: 1:00 PM EDT

Nikon SLM Solutions and Materialise invite you to a joint webinar introducing the Next-Gen Build Processor for Nikon SLM systems, now with support for larger files and more complex LPBF metal builds.

The Next-Gen Build Processor builds on previous versions with enhanced features, delivering improved performance and usability while enabling advanced toolpath strategies and optimized material parameters. With all material parameters validated by Nikon SLM Solutions, it provides a fully validated workflow from design to job file preparation.

In this webinar, you’ll learn how the Next-Gen Build Processor:

• Accelerates performance, achieving up to 10x faster processing and reducing slicing time from days to hours
• Improves printing speed through jump optimization for non-solid supports, cutting processing times significantly
• Enhances part quality with improved vector sorting and thermal control
• Enables low-angle printing, unlocking new applications, improving surface finish, and reducing post-processing and overall costs
• Is optimized for Next-Gen systems, with superior laser allocation
• Processes large datasets, including implicit geometries and complex builds

Join us to see how the Next-Gen Build Processor can help you realize the full potential of your Nikon SLM systems and scale your production.